Mfg Part Number: 11011 | NSN : 5962-00-166-6256 |
NIIN : 001666256 | CAGE Code : 34649 |
Manufacturer: Intel | Item Name : Microcircuit Memory |
FSC : 5962 Microcircuits Electronic |
Thank you for your interest in the NSN part 11011. This item was manufactured by Intel and is a Microcircuit Memory component with the NSN 5962-00-166-6256. This 11011 is available for immediate purchase, and we would be happy to provide you with a quick quotation for your comparisons. To begin, please fill out and submit an Instant RFQ form provided on this page. After receiving your request, an account manager will immediately start crafting a competitive quote that reflects your individual requirements.
Stacked Purchasing offers 11011 with various CAGE Code 34649 parts from Intel, one of the manufacturers on our thoroughly vetted approved vendor list. Whether it is 5962-00-166-6256 or any other component that we distribute, we stand by the quality of our products. Stacked Purchasing operates with AS9120B, ISO 9001:2015, and FAA AC 00-56B certification and accreditation, and we have an unmatched dedication to providing our customers with the best possible parts. Moreover, our team members take the time to identify customers' exact time requirements, and with our vast distribution network, we are agile in our shipping execution. Please get in touch with our team if you want to learn more about our services. We look forward to being your strategic sourcing partner.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-00-166-6256 Item Description: Microcircuit Memory | 5962 | 001666256 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
7 | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
11011 | 3 | 9 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.735 INCHES MINIMUM AND 0.830 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.295 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.055 INCHES MINIMUM AND 0.125 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
AFGA | OPERATING TEMP RANGE | +0.0/+70.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+160.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND LOW POWER AND 3-STATE OUTPUT AND WIRE-OR OUTPUTS AND EXPANDABLE AND W/DECODED OUTPUT AND W/BUFFERED OUTPUT AND W/STORAGE |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 11 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -20.0 VOLTS MINIMUM POWER SOURCE AND 5.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 10.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 10.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | ROM |
CZZZ | MEMORY CAPACITY | UNKNOWN |
TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
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