| Mfg Part Number: P4C116-45LMB | Alternate P/N: P4C11645LMB |
| NSN : 5962-01-299-4554 | NIIN : 012994554 |
| CAGE Code : 3DTT2 | Manufacturer: Pyramid Semiconductor Corp |
| Item Name : Microcircuit Memory | FSC : 5962 Microcircuits Electronic |
Thank you for your interest in the NSN part P4C116-45LMB. This item was manufactured by Pyramid Semiconductor Corp and is a Microcircuit Memory component with the NSN 5962-01-299-4554. This P4C116-45LMB is available for immediate purchase, and we would be happy to provide you with a quick quotation for your comparisons. To begin, please fill out and submit an Instant RFQ form provided on this page. After receiving your request, an account manager will immediately start crafting a competitive quote that reflects your individual requirements.
Stacked Purchasing offers P4C116-45LMB with various CAGE Code 3DTT2 parts from Pyramid Semiconductor Corp, one of the manufacturers on our thoroughly vetted approved vendor list. Whether it is 5962-01-299-4554 or any other component that we distribute, we stand by the quality of our products. Stacked Purchasing operates with AS9120B, ISO 9001:2015, and FAA AC 00-56B certification and accreditation, and we have an unmatched dedication to providing our customers with the best possible parts. Moreover, our team members take the time to identify customers' exact time requirements, and with our vast distribution network, we are agile in our shipping execution. Please get in touch with our team if you want to learn more about our services. We look forward to being your strategic sourcing partner.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-299-4554 Item Description: Microcircuit Memory | 5962 | 012994554 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| P4c116-45lmb | 5 | 1 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.392 INCHES MINIMUM AND 0.408 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.292 INCHES MINIMUM AND 0.308 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.062 INCHES MINIMUM AND 0.078 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND BIDIRECTIONAL AND W/ENABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 22 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.3 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 LEADLESS |
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